6/5/2023 0 Comments Reflow oven pcbThe nitrogen reflow oven has one distinct feature, during the production it is to fill nitrogen inside the oven. Its working principle is that 80% of the heat energy is emitted in the form of electromagnetic wave – infrared ray, the temperature of solder joints increases after infrared radiation, then complete the welding process.Ĭonvection reflow oven 10 Zones – Click to explore it Infrared reflow oven usually is small-sized. So, What is the difference between these kinds of reflow oven? 2.1 Definition Infrared reflow oven VS Convection reflow oven VS Nitrogen reflow oven ②Vertical reflow soldering oven is applicable for different kinds of production demands, especially for mass production. ①Bench type reflow oven is suitable for small and medium-sized PCB assembly production with stable performance and economic price of highly flexible production arrangement. There are many types of reflow soldering oven according to different working technology, but we just list three main types among it in the following, please have a look: Many usually exclude the cooling zone when calculating the temperature zone, that is, only the heating zone, heat preservation zone, and welding zone. Usually, the length for each soldering zone is about 45-50cm, the quantity for the soldering zone is from three to fifteen or even more.įurthermore, for the function of the soldering zone, reflow welding has at least three temperature zones, namely the preheating zone, welding zone and cooling zone. PCB enters into the cooling area to solidify the solder joint reflow welding is completed.The liquid solder can wet, diffuse, diffuse or reflow the solder pad, component end and pin of PCB to form a solder joint. When the PCB enters the welding area, the temperature rises hastily to make the solder paste melt.When PCB enters the insulation area, the PCB and components are fully preheated to prevent PCB and components from being damaged due to PCB suddenly entering the welding high-temperature area.The solder paste softens, collapses, and covers the pad, isolating the pad and component pin from oxygen. At the same time, the flux in the solder paste moistens the pad, component end, and pin. When the PCB enters the heating zone, the solvent and fuel are inside the solder paste evaporate. Therefore, it is called “reflow soldering”, because the gas circulates in the welder to generate high temperature to achieve the welding purpose. Reflow soldering relies on the effect of hot airflow on the solder joint, and the soldering flux reacts physically under the fixed constant excessive temperature air go with the drift to reap to achieve SMD welding Technically, Reflow is to realize the mechanical and electrical connection between the solder end or pin of the surface assembly component and the PCB pad by remelting the paste solder allocated to the PCB pad in advance. With the development of SMT technology and the emergence of SMC and SMD, Reflow soldering technology and equipment as parts of SMT technology have been developed accordingly, and its application has become more and more extensive, almost in all electronics product fields. It working principle is as the following:Īlways, it locates after the pick and place machine, and solders the PCB board and component with heating and melting, at last cool the solder to link the PCB board and component together. 1.2 Working PrincipleĪs one of the three main machines in the SMT line. Most of the components are chip capacitor, chip inductor, mount transistor, and two-transistor. Generally, it is used in the assembly of a hybrid integrated circuit board. W hat is A R eflow S oldering oven? 1.1 Background & DefinitionĪ Reflow oven is a machine used primarily for Reflow soldering of surface mount electronic components to printed circuit boards (PCB). ▽ Customized reflow soldering oven for HUAWEI (5G products) Shenzhen, Qingdao, Dongguan, Wuhan factory.1. ▽ Poland customer ( Battery Chargers and Adapters) - Full SMT production line ▽ Russia customer - Full SMT production line Use imported motors, speed adjuster, smoothly running, adjustable speed at 0-2000mm/min. Independent cooling area ensures the low temperature when PCB comes out. Both top and bottom zones hot air heating,good heater compensatory,High thermal efficiency,energy saving,speedy heating,suitable for soldering components like BGA,CSP etc.Special forced hot air circulation structure makes PCB and components heat evenly, Temperature Accuracy ± 1.5 ☌, room temperature settling time less than 20 minutes.
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